Technical Milestones
- 2013 Horizontal viafill plater for further viafill capacity and Cu consistency
- 2012 Drilling and X-ray drilling for high precision PTH to Cu
- 2010 Outerlayer and SM LDI for high resolution automatic imaging
- 2010 CCD routing/drilling for heavy metal and high precision
- 2008 Introduction of viafill process for stacked microvias
- 2002 Heatsink PCB production
- 2000 Use of laser direct imaging (LDI)
- 1999 Introduction of multilayer PCBs of high frequency laminates
- 1998 Aspocomp Oulu starts microvia PCB production
- 1996 Aspo Oy is one of the first companies worldwide to start laser drilling of microvia PCBs
- 1987 Aspo Oy makes the first Teflon PCBs