Technical Milestones

• 2013 Horizontal viafill plater for further viafill capacity and Cu consistency
• 2012 Drilling and X-ray drilling for high precision PTH to Cu
• 2010 Outerlayer and SM LDI for high resolution automatic imaging
• 2010 CCD routing/drilling for heavy metal and high precision
• 2008 Introduction of viafill process for stacked microvias
• 2002 Heatsink PCB production
• 2000 Use of laser direct imaging (LDI)
• 1999 Introduction of multilayer PCBs of high frequency laminates
• 1998 Aspocomp Oulu starts microvia PCB production
• 1996 Aspo Oy is one of the first companies worldwide to start laser drilling of microvia PCBs
• 1987 Aspo Oy makes the first Teflon PCBs