Factory Tour

Factory Tour

CAM, Checking and processing of PCB manufacturing files.

FR4 laminate and prepreg are the main raw materials for PCB.

Inner layer exposing by lased direct imaging (LDI).

Inner layer Developing, Etching and Stripping (DES).

Inner layer Developing, Etching and Stripping (DES).

Inner layer Developing, Etching and Stripping (DES).

Multilayer press.

Mechanical drilling.

Laser drilling.

Our employees are very experienced PCB professionals

Chemical lab, process control of plating chemistry.

Chemical lab, process control of plating chemistry.

Electroless Cu plating.

Horizontal Cu plating.

Horizontal plating line for filling microvias of advanced HDI PCBs

Loading inner layers to DES

Pattern plating.

Strip-Etch-Strip line (SES).

Work-in-process (WIP) is fully traceable in our production system

Optical inspection of the outer layer (AOI).

Optical inspection of the outer layer (AOI).

Layer to layer registration is very accurate due to modern x-ray technology

Quality control.

Soldermask pre-treatment.

Soldermask ink.

Soldermask pre-cure.

Image transfer is made in clean room areas

Modern wet processes in use

Our surface finish options are ENIG, ENIG+OSP (SIT), OSP, immersion tin, immersion silver, lead-free HASL (SN100), Hard gold and soft gold

Electrical testing.

Quality control.

Languages

Search form