CAM, Checking and processing of PCB manufacturing files.
FR4 laminate and prepreg are the main raw materials for PCB.
Inner layer exposing by lased direct imaging (LDI).
Inner layer Developing, Etching and Stripping (DES).
Our employees are very experienced PCB professionals
Chemical lab, process control of plating chemistry.
Electroless Cu plating.
Horizontal Cu plating.
Horizontal plating line for filling microvias of advanced HDI PCBs
Loading inner layers to DES
Strip-Etch-Strip line (SES).
Work-in-process (WIP) is fully traceable in our production system
Optical inspection of the outer layer (AOI).
Layer to layer registration is very accurate due to modern x-ray technology
Image transfer is made in clean room areas
Modern wet processes in use
Our surface finish options are ENIG, ENIG+OSP (SIT), OSP, immersion tin, immersion silver, lead-free HASL (SN100), Hard gold and soft gold