PCBs With Cooling Features
Aspocomp provides a wide variety of PCB having design-in cooling feature for high power components. It is possible to choose some tailored solution right under the component which leads heat flow eficiently through the PCB. Aspocomp can provide following PCB cooling technologies:
- Via farm cooling by filled+capped vias
- Pre-bonded metalback
- Post-bonded metalback
- Embedded T-coin
- Embedded I-coin
- Embedded C-coin
Embedded coin technology enables to insert piece of solid copper just below the component.
Each solution has different thermal resistance and cost background, please contact us to find most optimal solution.