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Source: Aspocomp Group Oyj

Aspocomp’s financial information and Annual General Meeting in 2019

Aspocomp Group Plc, Company Announcement, September 21, 2018 at 9:00 a.m.
 
Aspocomp Group Plc will publish its financial information in 2019 as follows:

Financial Statements 2018: Thursday, February 28
Interim Report January-March, 2019: Tuesday, April 30
Half-yearly Report January-June, 2019: Thursday, August 8
Interim Report January-September, 2019: Tuesday, October 29

The Financial Statements, Half-Yearly Report and Interim Reports will be released at around 9:00 a.m. EEST on the given dates. Aspocomp's silent period commences 30 days prior to the publication of its financial information.

Annual Report 2018
Annual Report 2018 will be published on the company’s website on Wednesday, March 13, 2019. Annual Report contains Financial Statements, the report of the Board of Directors and Corporate Governance Statement.

Annual General Meeting 2019
Aspocomp’s Annual General Meeting 2019 is scheduled for Wednesday, April 3 at 10:00 a.m. EEST. The meeting will be convened by the company’s Board of Directors later on.

Shareholders, who wish to have an issue on the agenda of the AGM, shall notify the company’s Board of Directors in writing on Thursday, January 31, 2019 at the latest by mail to address Aspocomp Group Plc., AGM, Keilaranta 1, 02150 Espoo, Finland or by email to yhtiokokous(at)aspocomp.com.

For further information, please contact Mikko Montonen, CEO,
tel. +358 20 775 6860, mikko.montonen(at)aspocomp.com.

ASPOCOMP GROUP PLC

Mikko Montonen
CEO

Aspocomp – a service company specializing in PCB technologies

A printed circuit board (PCB) is used for electrical interconnection and as a component assembly platform in electronic devices. Aspocomp provides PCB technology design, testing and logistics services over the entire lifecycle of a product. The company’s own production and extensive international partner network guarantee cost-effectiveness and reliable deliveries.

Aspocomp’s customers are companies that design and manufacture telecommunication systems and equipment, automotive and industrial electronics, and systems for testing semiconductor components for security technology. The company has customers around the world and most of its net sales are generated by exports.

Aspocomp is headquartered in Espoo and its plant is in Oulu, one of Finland’s major technology hubs.

www.aspocomp.com