Capability and Design Guidelines

Manufacturing a Printed Circuit Board involves of utilizing a broad range of different technologies. Summarized overview of Aspocomp capability and the most important design rules enabling good manufacturing yield can be found under Design rules section.

It is not so common that thin HDI PCBs and thick HDI PCBs are not manufactured in a single factory. However, at our plant in Oulu, Finland we manufacture these two board types under the same roof. As there are still differences between design rules for thin and thick boards and it’s not possible to combine all parameters to same PCB, we have separated our HDI PCB design rules into two general groups: thin HDIs (<1,4mm board thickness) and thick HDIs (>1,4mm thick boards).

General summary of our design rules capability can be found under Design capability and guidelines section and detailed design guideline documents can be asked by contacting us. 

You can always contact the Aspocomp sales team to check our capabilities on a case by case basis if necessary or with any other questions you might have in mind.

Technical Milestones
Technical Milestones
Laminate Options
Laminate Options
Generic PCB Information
Generic PCB Information
Specific Instructions
Laser Via reliability
Design Capability and Guidelines
Design capability and guidelines