Our production is fine-tuned to manufacture high technology HDI (High Density Interconnection) PCBs. Products include large and thick HDI PCBs and also very high density thin stacked microvia constructions.
HDI and Advanced HDI technology enables design for very high density components like 400u pitch BGA with a high amount of I/O pins. This component type usually requires a PCB using multiple layer HDI, for example 4+4b+4. Aspocomp's manufacturing is specialized in express production of this PCB type.
See the capability page for more design parameters.