PCBs With Cooling Features
Aspocomp provides a wide variety of PCBs having designed-in cooling feature for high power components. It is possible to choose a tailored solution right under the component that leads heat flow efficiently through the PCB. Aspocomp can provide the following PCB cooling technologies:
- Via farm cooling by filled+capped vias
- Pre-bonded metalback
- Post-bonded metalback
- Embedded T-coin
- Embedded I-coin
- Embedded C-coin
Embedded coin technology enables to insert piece of solid copper right under the component.
Each solution has a different thermal resistance and cost background. Please contact us to find the most optimal solution.