PCB Products and Services / Products / PCBs for Component Cooling

PCBs With Cooling Features

Aspocomp provides a wide variety of PCBs having designed-in cooling feature for high power components. It is possible to choose a tailored solution right under the component that leads heat flow efficiently through the PCB. Aspocomp can provide the following PCB cooling technologies:

  • Via farm cooling by filled+capped vias
  • Pre-bonded metalback
  • Post-bonded metalback
  • Embedded T-coin
  • Embedded I-coin
  • Embedded C-coin

Embedded coin technology enables to insert piece of solid copper right under the component.

Each solution has a different thermal resistance and cost background. Please contact us to find the most optimal solution.